RT-Dongfeng Resin
Product Name: RUNTAI RT-Dongfeng Resin Diamond Grinding Pad
Product Series: H1, H2, H3, and H4
Available Grits: 50#, 100#, 200#, and 400#
Product Type: Four-Step Resin-Bond Diamond Dry-Grinding Pad
Attachment Type: Hook-and-Loop
Working Method: Dry Grinding
Suitable Equipment: Floor Grinders and Floor Polishing Machines
Suitable Surfaces: Polished Concrete, Densified Concrete, Dry-Shake Hardener Floors, Inorganic Terrazzo, Cement-Based Terrazzo, and Old Concrete Floors
Main Functions: Metal Scratch Removal, Grinding Pattern Refinement, Fine Grinding, Surface Flatness Improvement, and Preparation for Final Polishing
The RUNTAI RT-Dongfeng Series is a four-step resin-bond diamond dry-grinding system designed for fine grinding and surface preparation before the final polishing stages of concrete floors.
The system consists of four sequential steps: H1, H2, H3, and H4. It is mainly used after metal-bond grinding to remove metal scratches, refine grinding patterns, improve surface flatness, and prepare the floor for high-grit polishing.
Through a progressive coarse-to-fine grinding process, the Dongfeng Series gradually removes scratches left by the previous step, producing a smoother and more refined floor surface. It creates a consistent foundation for subsequent polishing with 800# and 1500# polishing pads.
The series provides stable cutting performance, uniform scratch patterns, smooth grit transitions, and high dry-grinding efficiency. Its four-step process reduces unnecessary grinding stages and improves overall workflow efficiency while maintaining consistent floor quality.
The Dongfeng Series is suitable for polished concrete, densified concrete floors, dry-shake hardener floors, inorganic terrazzo, cement-based terrazzo, and old concrete floor renovation. It can be combined with RUNTAI metal-bond grinding tools and high-grit polishing pads to form a complete floor grinding and polishing system.
Four-Step Grinding System
H1／50#: Used after metal-bond grinding to quickly remove deeper metal scratches and begin surface refinement.
H2／100#: Further refines the H1 grinding pattern, reduces coarse scratches, and improves surface uniformity.
H3／200#: Removes medium-level scratches and increases surface smoothness, creating a stable foundation for fine grinding.
H4／400#: Used for final fine grinding and surface refinement, producing a smooth and uniform base for fast gloss development with 800# and 1500# polishing pads.
Product Features
- H1–H4 four-step dry-grinding system
- Smooth transition between metal grinding and high-grit polishing
- Stable cutting performance and efficient scratch removal
- Fine and uniform grinding patterns
- Flexible floor contact to reduce missed grinding areas
- Efficient dust removal and heat dissipation
- Fewer grinding steps for improved working efficiency
- Hook-and-loop attachment for quick installation and replacement
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