RT-X2
Product Name: RUNTAI X2 Metal-Bond Diamond Grinding Tool
Segment Structure: Double-layer trapezoidal and wedge-shaped segments
Segment Thickness: Approximately 10 mm
Bond Type: Medium-soft
Suitable Surfaces: Concrete floors, cement-based floors, and medium-hard to hard concrete
Main Applications: Surface opening, coarse grinding, floor leveling, laitance removal, old floor renovation, and substrate preparation before epoxy coating removal
- Double-layer trapezoidal segment design with strong cutting performance
- Large effective grinding area for improved working efficiency
- Excellent dust removal and heat dissipation
- Reduced risk of segment clogging
- Uniform segment wear and stable grinding performance
- Medium-soft bond balancing sharpness and durability
- Suitable for both dry and wet grinding
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