RT-20H

The RUNTAI RT-20H is a Ø250mm metal-bond diamond grinding plate designed for concrete surface opening, coarse grinding, floor leveling, laitance removal, uneven-surface correction, and old floor renovation.

The 20 H-shaped segments increase the effective contact area between the grinding plate and the floor, enabling smoother machine operation and more uniform grinding patterns. This structure is suitable for medium and large floor grinding machines, improving consistency in large-area applications while maintaining strong cutting efficiency.

The product is available in 20#, 30#, and 60# grits. The 20# grit is suitable for aggressive surface opening and heavy coarse grinding. The 30# grit is suitable for general surface opening, laitance removal, and coarse floor leveling. The 60# grit is suitable for refining scratches after coarse grinding and for transitional grinding before the next fine-grinding stage.

For soft, medium-hard, and hard concrete floors, the bond type and hardness can be customized accordingly, allowing continuous diamond exposure and achieving a reliable balance between sharpness, wear resistance, and service life.

Grit Applications

20#: Suitable for aggressive surface opening, correction of significant unevenness, heavy coarse grinding, and fast material removal.

30#: Suitable for general surface opening, laitance removal, coarse grinding on old floors, and initial floor leveling.

60#: Suitable for refining coarse grinding scratches, surface correction, and transitional grinding before resin pad applications.

Product Features

• Ø250mm large grinding plate, suitable for large-area applications
• 20 evenly distributed H-shaped segments for stable operation
• Large effective grinding area for uniform grinding patterns
• High cutting efficiency and stable material removal
• Efficient dust removal and heat dissipation with reduced clogging
• Customizable appearance, bond type, and bond hardness
• Available in 20#, 30#, and 60# grits
• Suitable for both dry and wet grinding