RT-20J

The RUNTAI RT-20J is a Ø250mm metal-bond diamond grinding plate designed for concrete surface opening, heavy coarse grinding, floor leveling, laitance removal, uneven-surface correction, scratch refinement, and old floor renovation.

Its 20 J-shaped segments provide a large effective grinding area, improving machine stability and promoting more uniform segment wear. The design also helps produce consistent grinding patterns during large-area applications.

The product is available in 16#, 30#, 60#, and 120# grits, covering multiple working stages from aggressive surface opening and coarse leveling to scratch refinement and transitional preparation before resin grinding.

Different bond types and hardness levels can be customized for soft, medium-hard, and hard concrete. Selecting the appropriate bond ensures continuous diamond exposure and provides a reliable balance between cutting sharpness, wear resistance, and service life.

Grit Applications

16#: Suitable for aggressive surface opening, heavy coarse grinding, correction of significant unevenness, and fast material removal.

30#: Suitable for general surface opening, laitance removal, coarse grinding of old floors, and initial floor leveling.

60#: Suitable for refining scratches after coarse grinding, surface correction, and improving floor flatness.

120#: Suitable for further refining metal grinding marks, reducing surface roughness, and creating a uniform foundation for subsequent resin grinding.

Product Features

• Ø250mm grinding plate for large-area applications
• 20 evenly distributed J-shaped segments for stable operation
• Continuous cutting edges for efficient material removal
• Large effective grinding area for uniform grinding patterns
• Efficient dust removal and heat dissipation
• Grit range from 16# to 120# for smooth process transitions
• Customizable appearance, bond type, and bond hardness
• Suitable for both dry and wet grinding