RT-20T
Product Name: RUNTAI RT-20T Diamond Grinding Plate
Model: RT-20T
Diameter: Ø250mm
Segment Structure: 20 T-Shaped Oval Metal-Bond Diamond Segments
Available Grits: 20#, 30#, and 60#
Bond Type: Customizable
Bond Hardness: Customizable
Appearance: Customizable
Working Method: Dry and Wet Grinding
Suitable Equipment: Medium and Large Floor Grinding Machines
Suitable Surfaces: Concrete Floors, Dry-Shake Hardener Floors, Densified Concrete Floors, and Old Concrete Floors
Main Applications: Surface Opening, Coarse Grinding, Floor Leveling, Laitance Removal, Uneven-Surface Correction, Scratch Refinement, and Old Floor Renovation
The RUNTAI RT-20T is a Ø250mm metal-bond diamond grinding plate designed for concrete surface opening, coarse grinding, floor leveling, laitance removal, uneven-surface correction, old floor renovation, and scratch refinement after coarse grinding.
Its 20 T-shaped oval segments increase the effective contact area between the grinding plate and the floor, providing smoother machine operation and more uniform grinding patterns. It is suitable for medium and large floor grinding machines and delivers consistent cutting performance and high productivity in large-area applications.
The product is available in 20#, 30#, and 60# grits. Different bond types and hardness levels can be selected for soft, medium-hard, and hard concrete, ensuring continuous diamond exposure and a reliable balance between sharpness, wear resistance, and tool life.
Grit Applications
20#: Suitable for aggressive surface opening, heavy coarse grinding, correction of significant unevenness, and fast material removal.
30#: Suitable for general surface opening, laitance removal, coarse grinding of old floors, and initial floor leveling.
60#: Suitable for refining scratches after coarse grinding, surface correction, and transitional grinding before resin-pad applications.
Product Features
- Ø250mm grinding plate for large-area applications
- 20 T-shaped oval segments for balanced pressure distribution
- Smooth surface engagement and stable machine operation
- Large effective grinding area for uniform grinding patterns
- Efficient dust removal and heat dissipation
- Continuous diamond exposure for consistent cutting performance
- Customizable appearance, bond type, and bond hardness
- Suitable for both dry and wet grinding
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